Thermally Conductive Adhesives (Dielectric)
https://www.adherasg.com/conductive-adhesives
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Electronic devices are becoming smaller, lighter, and more powerful, which has increased the demand for effective thermal dissipation materials. Thermally conductive dielectric adhesives are designed to assist in heat dissipation while maintaining electrical insulation. These materials are integrated with thermally conductive fillers and are ideal for applications that require dissipating heat away from temperature-sensitive components through very thin bond lines.
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Key Properties
Formulation: 1- and 2-component adhesives.
Applying Methods: Dispensing, stamping, stencil printing.
Curing:
- 1-component: As fast as 1-2 minutes at 150°C, or 30 minutes at 80°C.
- 2-component: As fast as 1 minute at 80°C, or 24 hours at 25°C.
Thermal Conductivity: Ranges from 0.7 to 2.3 W/m.K.
Work Life: Varies from as little as 4 minutes for fast-cure versions to over 5 days for others.
Application-Specific Options:
- Variety of viscosities for different application methods, including non-sagging (high aspect ratio) options.
- Non-abrasive fillers for sensitive components.
- Low outgassing formulations that are ESA-approved.
- Flexibile materials to overcome coefficient of thermal expansion (CTE) mismatch.
- Economical and fast-cure options available.
- Specific mix-ratios for 2-component adhesives.