Thermal Gap Fillers
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Thermal gap-filler materials are a key component in modern electronics, especially for high-reliability automotive and industrial applications that face harsh environments. Unlike traditional thermal pads, liquid gap fillers provide excellent thermal dissipation, vibration resistance, and high adhesion. They are also silicone-free, which helps prevent contamination of sensitive electronic parts.
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Key Properties
Formulation: Liquid, 2-component gap-filler materials.
Applying Methods: Dispensing
Curing: Medium to fast cure at low temperatures.
Thermal Conductivity: Ranges from 0.8 to 1.3 W/m.K.
Application-Specific Options:
- Options for medium, high, and very high viscosity, including non-sagging (high aspect ratio) formulations.
- Several products are very flexible, making them suitable for "low stress applications”.
- Solvent-free and epoxy-based chemistry
- Available in various shades of dark orange and red.